Improved Performance
- Low resistance connection due to increased metallization thickness through via
- Pure plated Cu and Au, no ceramic filler material
Improved Reliability
- Connection is independent of adhesion to via’s walls
- Through hole can be inspected after mounting to carrier
Structural Integrity
- Metal overlaps wide area of top conductor, forming a plated rivet
- Avoids possibility of closed voids entrapping liquids and gases
Datasheet / Catalogs
