Improved Performance
  • Low resistance connection due to increased metallization thickness through via
  • Pure plated Cu and Au, no ceramic filler material
Improved Reliability
  • Connection is independent of adhesion to via’s walls
  • Through hole can be inspected after mounting to carrier
Structural Integrity
  • Metal overlaps wide area of top conductor, forming a plated rivet
  • Avoids possibility of closed voids entrapping liquids and gases
Datasheet / Catalogs
Datasheet / Catalogs – Click to Download