Removing Excess Heat from Ungrounded Surface Mount Devices

Removing Excess Heat from Ungrounded Surface Mount Devices

ABSTRACT

Ungrounded components don’t have a path to remove heat built in. In tightly packed boards this can cause hot spots and reduce the life and functionality of components. This study will investigate using a thermal pipe to electrically isolate the component while providing a thermal conduction path to the ground.

An unwanted byproduct of any electric circuit is the generation of heat, which sometimes requires complex or expensive thermal management solutions. Components without a path to ground to dissipate that heat are constant problems in the electronics industry. These components cause the ambient temperature around them to increase which lowers the life expectancy of all components at this higher ambient temperature. Many solutions to this problem exist including mechanical design changes to increase airflow onto high power components to reduce their overall temperature.

Benefits of KYOCERA AVX Q-Bridge Technology:

  • High Thermal Conductivity
  • Low Thermal Resistance
  • Increases Circuit Reliability
  • More efficient thermal management

Release Date:

September 4th, 2024

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