Reducing Board Surface Area and Improving RF Performance by Embedding Ultra Thin Capacitors

Board space limitations are pushing for smaller components and greater component density while maintaining or improving broadband performance. The industry has tried to accommodate board limitations by embedding components within the board material itself. Even though many passive components are designed to have a minimal part height, traditional capacitors are thicker components, which makes them undesirable for embedded solutions. This study focuses on the Metal Oxide Silicon (MOS) Capacitor technology, and how these capacitors are ideal for embeddable applications, and help improve high-frequency performance.