Wire Bondable Interposers

Features & Benefits
  • Pad to Pad Spacing Down to 15um
  • High Conductivity Lines and Complex Routings
  • Bond Pads Compatible for High Speed Wire Bonding
Typical Applications
  • Optical Communications
  • Any Electronic System

The interposer can be utilized in a system in package serving as a high density substrate with a redistribution layer as well as offering precise linewidth control, increased performance, low power consumption, and high transmission speed.