Surface Mount Thermal Conductors for Heat Management
Written By: Jern Ng
Abstract:
Efforts to miniaturize electronics are becoming increasingly common as designers work to fit more components into smaller packages, offering low-weight, low-volume products. The continuous march toward electronic miniaturization brings to light one primary challenge: the dissipation of heat. As semiconductor manufacturing realizes smaller feature sizes, microprocessor capability is simultaneously advancing with greater functionality.
DOWNLOAD TECHNICAL PAPEREfforts to miniaturize electronics are becoming increasingly common as designers work to fit more components into smaller packages, offering low-weight, low-volume products. The continuous march toward electronic miniaturization brings to light one primary challenge: the dissipation of heat. As semiconductor manufacturing realizes smaller feature sizes, microprocessor capability is simultaneously advancing with greater functionality.
