Technical Articles / Whitepapers

Aluminum Electrolytic Capacitor Holder For Ruggedized Automotive Applications

On December 31, 2013   /   Connectors, News / Events / Press, Resources, Technical Articles / Whitepapers  
Aluminum Electrolytic Capacitor Holder For Ruggedized Automotive Applications

Aluminum Electrolytic Capacitor Holder For Ruggedized Automotive Applications Written By: Tom Anderson Abstract: Harsh environments such as automotive and industrial applications can be very demanding on larger electronic components, which are exposed to severe shock and vibration requirements. In order to protect these components, extra attention and most often times cost needs to be devoted to the processing and mechanical attachment within the device to the Printed Circuit Board (PCB).

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Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications

On December 31, 2013   /   Resources, Tantalum / Niobium / Polymer, Technical Articles / Whitepapers  
Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications

Solid Tantalum Capacitors: MnO2 vs. Polymer Cathodes for Optimal Performance in High-Reliability Military and Space Applications Written By: Ron Demcko Abstract: Solid tantalum capacitors have a long history of proven performance in high-reliability military and space applications. But not all capacitors are created equal — even within the same class. As is the case with virtually all component technologies, materials matter. This paper will discuss the differences in performance and reliability between solid tantalum capacitors with manganese dioxide (MnO2) cathodes and those with conductive polymer cathodes. Bell Laboratories introduced the first solid tantalum capacitors to market in the early 1950s. The first military specification for surface-mount tantalum capacitors (MIL-PRF-55365) was released in 1989 and introduced CWR09-style components. Since then, the

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Reliability of SuperCapacitors: Long-Term Reliability Test Data (Part 2)

On December 31, 2013   /   Resources, SuperCapacitors, Technical Articles / Whitepapers  
Reliability of SuperCapacitors: Long-Term Reliability Test Data (Part 2)

Reliability of SuperCapacitors: Long-Term Reliability Test Data (Part 2) Written By: Eric DeRose | Bob Knopsnyder | Bharat Rawal Abstract: Extensive testing of electronic components is required for an understanding of their device physics, their degradation behavior and their failure mechanisms for establishing their longterm reliability. Gaining a better understanding of part characteristics results in the utilization of the right part which can be recommended to customers depending on the application’s operating conditions such as voltage, temperature and relative humidity. Samples of all products produced are evaluated and tested for up to 4,000 hours to establish reliability test data. As we strive to be an industry leader in reliability of our supercapacitors or electric double-layer capacitors, we do our due

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Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing (Part 1)

On December 31, 2013   /   Resources, SuperCapacitors, Technical Articles / Whitepapers  
Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing (Part 1)

Reliability of SuperCapacitors: Unique Performance at 85°C & Self-Balancing (Part 1) Written By: Eric DeRose | Bob Knopsnyder | Bharat Rawal Abstract: Increasing use of supercapacitors on printed circuit boards (PCBs) is requiring a further understanding of the reliability of these components. As the use of these types of devices increases, the emphasis on reliability will become critical as sub-ppm failure rates are critical for minimizing and, in fact, eliminating rework of the PCBs in these applications. A broader understanding of the reliability of these devices will assist in reaching this goal. In this first of many publications, a study of our supercapacitor modules tested at 85°C at various applied voltages, at or below the rated voltage, will demonstrate the

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RF Passive Components Made Using Multi-Layer Organic Technology

On December 31, 2013   /   Resources, RF Microwave / Thin Film, Technical Articles / Whitepapers  
RF Passive Components Made Using Multi-Layer Organic Technology

RF Passive Components Made Using Multi-Layer Organic Technology Written By: Ron Demcko Abstract: RF circuitry might be based upon the use of discrete components, low temperature co-fired ceramics (LTCC), hybrid component technology, a combination of all these or more design methods/techniques – depending upon the frequency spectrum, circuit type and power of the circuit. A new family of RF components based upon laminating multiple layers of organic materials is emerging. These Multi-Layer Organic devices (MLO) offer significant electrical, physical and reliability advantages over traditional discrete RF or LTCC solutions. This paper outlines the basics of MLO devices. A discussion of the families of product offering and discusses performance advantages of MLO technology is provided.

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High-Reliability Solid Tantalum Capacitors

On December 31, 2013   /   Resources, Tantalum / Niobium / Polymer, Technical Articles / Whitepapers  
High-Reliability Solid Tantalum Capacitors

High-Reliability Solid Tantalum Capacitors Written By: Bob Fairey Abstract: Solid tantalum capacitors are among the most popular types of small, surface-mount capacitors for electronic applications across the consumer, automotive, aerospace, and medical device markets. This paper will provide some context on the development of tantalum capacitor technology and address issues frequently faced by users, including the need for low equivalent series resistance (ESR) in filtering applications and the need for the highest possible reliability and long-lifetime performance in aerospace and medical applications.

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The Frequency Response Effects of Internal Component Configuration on Multiple Ceramic Dielectric System

On December 31, 2013   /   Circuit Protection, News / Events / Press, Resources, Technical Articles / Whitepapers  
The Frequency Response Effects of Internal Component Configuration on Multiple Ceramic Dielectric System

The Frequency Response Effects of Internal Component Configuration on Multiple Ceramic Dielectric System Written By: S. Pala | R. Demcko | M. Berolini Abstract: The purpose of this paper is to discuss the frequency response effects of internal designs within ceramic systems. Those effects will be related to component performance parameters for devices used to suppress ESD and control EMI in high speed data lines, which are prone to be damaged by ESD. As communication speed increase, systems become more complicated and performance standards tighten, options to improve EMI/RFI performance becomes of great importance. Long term EMI performance and reliability are of particular importance in automotive, medical and aviation application sectors. A performance comparison will be made between single element

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EMI Control

On December 31, 2013   /   Resources, RF Microwave / Thin Film, Technical Articles / Whitepapers  
EMI Control

EMI Control Written By: Ron Demcko Abstract: EMI control is a key design goal in electronic systems. Three terminal FeedThru capacitor filters are one component option that can be used to simplify designs needing a broadband EMI filter response. The proper selection and use of SMT FeedThrus can lead to a variety of system improvements such as: reduced overall component count, less complex PCB layout, increasing manufacturability, improved reliability, and lower weight. It is because of these potential advantages that three terminal capacitors are now accepted in designs ranging from avionics to cell phones, automobiles to SMART grid controllers. This list of applications is growing as FeedThru capacitors evolve into smaller packages, obtain AEC Q200 qualification, and increase current ratings.

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SMT Process Characteristics of AVX TransGuards

On December 31, 2013   /   Circuit Protection, News / Events / Press, Resources, Technical Articles / Whitepapers  
SMT Process Characteristics of AVX TransGuards

SMT Process Characteristics of AVX TransGuards Written By: Ron Demcko Abstract: TransGuards are uniquely suited for wide-scale usage in SMT applications. TransGuards exhibit many advantages when used in SMT assemblies. This paper is a general guideline aimed at familiarizing users with the characteristics of soldering multilayer SMT ZnO TransGuards.

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Charge Control Methods for SuperCapacitors: Methods to Protect Power Sources from Damage Due to High Current Demands of SuperCapacitors

On December 31, 2013   /   News / Events / Press, SuperCapacitors, Technical Articles / Whitepapers  
Charge Control Methods for SuperCapacitors: Methods to Protect Power Sources from Damage Due to High Current Demands of SuperCapacitors

Charge Control Methods for SuperCapacitors: Methods to Protect Power Sources from Damage Due to High Current Demands of SuperCapacitors Written By: Ron Demcko | Joe Hock | Ashley Stanziola | Daniel West Abstract: Circuit designs exploiting the increased energy storage provided by supercapacitors, requires careful consideration of the increased power handling, than that of batteries, when charging these devices. The unique composition of electrochemical double-layer capacitors (EDLC) inherently allows them to withstand large currents. Table 1 below is a brief list of AVX cylindrical (SCC) and series-connected module (SCM) SuperCapacitors, displaying peak current supply and sink current capability. These maximum specifications will typically exceed current capability of charge sources, and lead to failures within the power supply system. Supercapacitors have

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Equivalent Circuit Model for Tantalum and Niobium Oxide Capacitors for use in Simulation Software

On December 31, 2013   /   News / Events / Press, Resources, Tantalum / Niobium / Polymer, Technical Articles / Whitepapers  
Equivalent Circuit Model for Tantalum and Niobium Oxide Capacitors for use in Simulation Software

Equivalent Circuit Model for Tantalum and Niobium Oxide Capacitors for use in Simulation Software Written By: J. Pelcak Abstract: In electrical circuit simulations with simulation software, ideal passive components (resistors, capacitors, inductors) are typically used because real component characteristics have been difficult to model. Unfortunately, ideal and real passive components have significant differences in their electrical behavior. These differences lead to discrepancies between actual hardware performance and expected results based upon simulation software programs. This paper will describe the development of equivalent circuit diagram for modeling real capacitor behavior. Use of this real model in simulation software can help make circuit development more efficient, as the circuits in the simulations should have similar behavior to the actual circuits. The model

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How to Choose the Correct Accu-Guard Fuse for Circuit Protection

On December 31, 2013   /   Circuit Protection, News / Events / Press, Resources, Technical Articles / Whitepapers  
How to Choose the Correct Accu-Guard Fuse for Circuit Protection

How to Choose the Correct Accu-Guard Fuse for Circuit Protection Written By: Irina Daynov | Barry Breen Abstract: The ACCU-GUARD is designed to meet the need of electronic circuits for a small, accurate surface mount fuse. This article presents design guidelines for achieving optimal protection of circuits with ACCU-GUARD. All major parameters are described including operating temperature, circuit voltage, fault current, steady state current and current pulses (Joule integral).

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Bluetooth and Antenna Matching

On December 31, 2013   /   Resources, RF Microwave / Thin Film, Technical Articles / Whitepapers  
Bluetooth and Antenna Matching

Bluetooth and Antenna Matching Written By: Ron Demcko Abstract: Antenna matching is an important aspect of any RF system. A properly designed and matched antenna increases the operating distance of the wireless product. Well matched antennas can transmit more power from the radio – therefore transmit over longer distances. Likewise, a well matched antenna allows the maximum transfer of energy from the receiving antenna to the receiver front end. Thus, allowing better receive characteristics for the system. Antenna matching becomes critical as antennas are reduced in size and placed in small modules that can experience wide temperature ranges and potentially have foreign objects in proximity. This paper discusses one class of intermediate Q capacitors used for SMT antenna matching

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Capacitor Selection and EMI Filtering

On December 31, 2013   /   Circuit Protection, News / Events / Press, Resources, Technical Articles / Whitepapers  
Capacitor Selection and EMI Filtering

Capacitor Selection and EMI Filtering Written By: Jeffrey Cain | Steve Makl Abstract: MLCCs are an inexpensive, yet effective, method for reducing the noise on both power/ground systems and signal lines themselves. Choosing the proper capacitance value such that the impedance is minimized at the frequency of interest also makes a difference.

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Conductivity Mechanisms and Breakdown Characteristics of Niobium Oxide Capacitors

On December 31, 2013   /   News / Events / Press, Resources, Tantalum / Niobium / Polymer, Technical Articles / Whitepapers  
Conductivity Mechanisms and Breakdown Characteristics of Niobium Oxide Capacitors

Conductivity Mechanisms and Breakdown Characteristics of Niobium Oxide Capacitors Written By: J. Sikula | J. Hlavka | V. Sedlakova | L. Grmela | P. Hoeschl | T. Zednicek | Z. Sita Abstract: Niobium Oxide capacitor, has already found its place in the market as a cost effective and reliable non-burning component. The study of conductivity mechanisms has been done to prove its excellent stability, reliability and non-burning performance. Set of electrical measurements as VA characteristics in forward and reverse mode, frequency characteristics of capacitance, temperature or time dependence of basic parameters together with measurements of basic physical parameters enabled to propose the theoretical model of NbO – Nb2O5 – MnO2 system. NbO Capacitor shows identical conductivity mechanism as tantalum capacitor,

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