Low ESR Tantalum Capacitors in Circuit Design Written By: Colin Li Abstract: Tantalum is a relatively scarce transition metal with several unique properties that make it a technology-critical element. It is highly corrosion-resistant and chemically inert. It is non-ferrous and non-magnetic, has a high melting point and density, and is extremely stiff. Most importantly, Tantalum readily forms a protective and electrically insulating oxide layer. This ability makes it an ideal candidate as the base building block of electrolytic capacitors.
Tantalum / Niobium / Polymer
Tantalum Capacitors: Characteristics and Component Selection Written By: Raul Wang Abstract: Capacitors are one of the fundamental building blocks of electrical circuits. Whether they are being used for energy storage, noise filtering, or timing/frequency design, capacitors are important in many common electrical devices. Today, various capacitor technologies are available, each with their own unique benefits and drawbacks, making each type ideal for different applications. Tantalum capacitors offer many interesting characteristics that combine to offer a unique solution to many design problems.
Tantalum Polymer vs Aluminum Polymer Performance as an Output Filter Capacitor for Miniature Switching Power Supplies Written By: Ron Demcko | Ashley Stanziola | Daniel West Abstract: Engineers have questioned the impact performance of converting Aluminum Polymer capacitors to Tantalum Polymer capacitors in applications where MLCCs are present on the output filter ‘bank’ of a small switching power supply. The reasons for designers to convert to Tantalum Polymer capacitors in the design ranged from long term reliability and stability to availability/delivery and company specific design guidelines. This investigation is intended to compare the interchangeability of Tantalum Polymer Capacitors in a design with the original Aluminum Polymer capacitors. The data collected was the measured output voltage ripple on a highly utilized
Solid tantalum capacitors have a long history of proven performance in high-reliability military and space applications. But not all capacitors are created equal — even within the same class. As is the case with virtually all component technologies, materials matter. This paper will discuss the differences in performance and reliability between solid tantalum capacitors with manganese dioxide (MnO2) cathodes and those with conductive polymer cathodes. Bell Laboratories introduced the first solid tantalum capacitors to market in the early 1950s. The first military specification for surface-mount tantalum capacitors (MIL-PRF-55365) was released in 1989 and introduced CWR09-style components. Since then, the product offerings governed by this specification have expanded to include CWR19-style capacitors with an extended range of CV values and CWR29-style
MLCC & TANTALUMINTERCHANGEABILITY Tantalum chip and Hi CV MLCC have a large degree of overlap in available capacitance ratings in common footprints. As MLCC production increased, many applications converted from tantalum to MLCC for many filtering, bypass, and hold-up applications. With the increasing demands seen for low voltage digital applications, tantalum electrolytic technologies have become a first choice for MLCC substitution. KYOCERA AVX is a leading international manufacturer and supplier of a wide range of advanced electronic components, including: capacitors, inductors, filters, and circuit protection devices. The KYOCERA AVX tantalum electrolytic division has maintained a leadership position in automotive, industrial, medical, space, military, consumer electronics, communications, and transportation markets for nearly 50 years. Maximum Available Capacitance by Case Size (6.3V):
Temperature Stability Assessment of GaN Power Amplifiers with Matching Tantalum Capacitors Written By: Ron Demcko | Mitch Weaver | Daniel West Abstract: Wide band gap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power conversion to RF transistors and MMICs. End users recognize the advantages of GaN technology as an ability to operate under higher currents and voltages. RF GaN market is expected to grow at 22.9 % CAGR over 2017-2023, boosted by implementation of 5G networks.  During the past years, the wide band semiconductors have reported achievement of >1000 V BDV that opens new challenges for high power industrial applications such as electric traction systems in trams, trolley buses or
High-Reliability Solid Tantalum Capacitors Bob Fairey AVX Corporation, One AVX Blvd, Fountain Inn, SC 29644www.avx.com Solid tantalum capacitors are among the most popular types of small, surface-mount capacitors for electronic applications across the consumer, automotive, aerospace, and medical device markets. This paper will provide some context on the development of tantalum capacitor technology and address issues frequently faced by users, including the need for low equivalent series resistance (ESR) in filtering applications and the need for the highest possible reliability and long-lifetime performance in aerospace and medical applications. Figure 2: The dielectric surface area of a tantalum capacitor anode compared to its finished size. Over the course of the following decades, tantalum capacitor technology evolved to include several form factors.
Voltage Derating Rules for Solid Tantalum and Niobium Capacitors Written By: Tomáš Zedníček | John Gill Abstract: For many years, whenever people have asked tantalum capacitor manufacturers for general recommendations on using their product, the consensus was “a minimum of 50% voltage derating should be applied”. This rule of thumb has since become the most prevalent design guideline for tantalum technology. This paper revisits this statement and explains, given an understanding of the application, why this is not necessarily the case. With the recent introduction of niobium and niobium oxide capacitor technologies, the derating discussion has been extended to these capacitor families also.
Ultrathin Discrete Capacitors for Emerging Embedded Technology Written By: Radim Uher | Tomas Zednicek Abstract: Passive components can represent as much as 70% of PCB footprint in today’s electronic systems. The development of a suitable technology whereby integrated passive components are embedded into the PCB body has been one of the key trends in downsizing for more than a decade. Latest achievements have allowed the implementation of this ‘embedding technology’ into pre-production and even mass production. The next step requires the involvement of the complete supply chain, including traditional passive component manufacturers. This paper will present the state of the art in the development of ultrathin discrete capacitor technology and discuss the challenges of overcoming mechanical, electrical and thermo-mechanical issues
Thermal Management of Surface Mounted Tantalum Capacitors Written By: Ian Salisbury Abstract: This paper covers thermal management of surface mounted tantalum capacitors, and explores the thermal characteristics and how these are modified by the thermal interconnection substrate. The paper explores the different methods of mounting to reduce the thermal resistance to the PCB, also the affect of the design of connection pads on the PCB to reduce the thermal stress on the capacitor.