Processing Guidelines for SMPS Multilayer Ceramic Capacitors
Written By: John Maxwell | Mark Doty Abstract:
Surface mount technology and high current layout techniques will be used as high frequency switch mode power supplies move to one megahertz and beyond. There are practical SMT size limitations to components without compliant leads due to solder joint failure but adding leadframes to larger parts does not degrade electrical performance while enhancing reliability. DOWNLOAD TECHNICAL PAPER
Surface mount technology and high current layout techniques will be used as high frequency switch mode power supplies move to one megahertz and beyond. There are practical SMT size limitations to components without compliant leads due to solder joint failure but adding leadframes to larger parts does not degrade electrical performance while enhancing reliability.
