The 8041 Series are super small and low-profile wire to board type connectors featuring a pitch of 0.9mm and mating height of 0.9mm which is one of the lowest in the industry (based on research by Kyocera Corporation; as of September 2023). These products were developed to meet market requirements for high- density packaging, especially designed for small mobile devices.
Suitable for small consumer devices such as smartphones, tablet PCs, wearable devices, laptops, audio equipment and game machines.
A pinching structure (two-point contact design) is adopted to enhance resistance to vibrations or drop shocks and ensure high contact reliability. AWG #32, a wire of the standard type, is applicable.
A four-point insulator locking structure is adopted to ensure tolerance to impacts and vibrations, which enables a firm “click” feeling and assured retention force in mating despite its low profile.
Nickel-plated area on the contact prevents solder wicking.
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