News / Events / Press

Single Contact IDC Connector with PTH Terminations

Single Contact IDC Connector with PTH Terminations

FOUNTAIN INN, S.C. (May 13, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has added a single contact, wire-to-board (WTB) insulation displacement connector (IDC) with plated through hole (PTH) terminations to its proven 9176 Series, which, prior to the addition, was exclusively comprised of surface mount technology (SMT) connectors. Delivering the same features and benefits for which the 9176 Series is known — including a gas-tight connection to the PCB for long-term reliability, preassembled strain relief caps with through-wire or end-stop configurations for maximum flexibility, reduced cost compared to hand soldering and two-piece connector options, and the tested ability to withstand automotive levels of shock, vibration, and temperature cycling — the new single tine 9176-60X

New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial-Leaded Capacitors

New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial-Leaded Capacitors

FOUNTAIN INN, S.C. (May 12, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced the new SV Series high voltage, automotive grade, multilayer ceramic (MLC), radial-leaded capacitors. Qualified to AEC-Q200 and rated for 1,000VDC, the new SV Series capacitors are designed with C0G (NP0) Class I dielectric materials, which exhibit an extremely low dissipation factor — providing excellent high rms current handling capabilities with minimal power losses in medium to high power resonant converters — and radial leads, which enable the mechanical decoupling of the MLC chip from the board, and provide the maximum mechanical stress relief necessary for harsh automotive applications. Conformally coated to eliminate the potential for arc flashover, SV Series capacitors

New 2MM Vertical Poke-Home WTB Contact for Light Industrial Applications

New 2MM Vertical Poke-Home WTB Contact for Light Industrial Applications

FOUNTAIN INN, S.C. (May 12, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new 2mm vertical poke-home wire-to-board (WTB) contact. The latest addition to AVX’s 70-9296 Series, the new micro contact accepts 26–22AWG solid or stranded wires, supports current ratings as high as 8A, and is 37% smaller than the next smallest offering in the series (a 3mm vertical poke home WTB contact), which makes it compatible with smaller wire gauges and devices, and extends the applications for the series to light industrial electronics, such as display case and under cabinet SSL products with lower current and shorter runs, switches, lighting strips, and motion, pressure, and temperature sensors, amongst several others. The

AVX to Attend & Announce New Products at EDS 2015

FOUNTAIN INN, S.C. (April 28, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, is attending the 2015 Electronic Distribution Show (EDS), which will take place May 12 – 15 at The Mirage Hotel and Casino in Las Vegas. At the event, AVX will introduce four new products, meet with its various sales and distribution partners, and attend the 2015 ECN Impact Awards as a finalist in the Passive Components and Discrete Semiconductors category. The premier annual event for the international electronic distribution industry, EDS hosts approximately 5,000 individuals representing more than 80% of the industry each year. Participants include electronic distributors, suppliers who provide distributors with an array of value-added equipment and services in addition

AVX Honored with a 2014 TTI Asia Supplier Excellence Award

AVX Honored with a 2014 TTI Asia Supplier Excellence Award

FOUNTAIN INN, S.C. (April 24, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has received a prestigious 2014 TTI Asia Supplier Excellence Award. Bestowed by TTI, Inc., the leading authorized distributor of interconnect, passive, electromechanical, and discrete components, the award honors AVX for its successful fulfillment of several key quality performance metrics designed to elevate supplier and distributor performance in order to ensure utmost customer satisfaction. The 2014 TTI Asia Supplier Excellence Award represents the highest recognition possible of a supplier’s performance within TTI Asia with regard to quality acceptance, ship-to-commit delivery date, effective business systems, ease of doing business, and the quality and efficacy of field employee and management relationships. Mr. Anthony Chan, President,

High Performance IDC Contacts for Harsh Environments

High Performance IDC Contacts for Harsh Environments

FOUNTAIN INN, S.C. (MARCH 17, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced a single contact version of its proven 9176 Series insulation displacement connectors (IDCs), which are widely recognized for providing highly reliable, gas-tight wire-to-board connections in a range of harsh environment applications. Backward compatible with existing 9176 Series connectors with regard to contact and footprint, the new 9176-65X single tine IDC contacts exhibit the same robust, reliable performance the series is known for while reducing cost by 25%, width by 50% (2.5mm vs. 5.0mm), and height by 10% (5.05mm vs. 5.6mm), the latter of which is especially valuable for SSL applications, as it helps prevent shadowing. Designed to satisfy the demanding

Voltage Derating Rules for Solid Tantalum and Niobium Capacitors

Voltage Derating Rules for Solid Tantalum and Niobium Capacitors

Voltage Derating Rules for Solid Tantalum and Niobium Capacitors Written By: Tomáš Zedníček | John Gill Abstract: For many years, whenever people have asked tantalum capacitor manufacturers for general recommendations on using their product, the consensus was “a minimum of 50% voltage derating should be applied”. This rule of thumb has since become the most prevalent design guideline for tantalum technology. This paper revisits this statement and explains, given an understanding of the application, why this is not necessarily the case. With the recent introduction of niobium and niobium oxide capacitor technologies, the derating discussion has been extended to these capacitor families also.

Ultrathin Discrete Capacitors for Emerging Embedded Technology

Ultrathin Discrete Capacitors for Emerging Embedded Technology

Ultrathin Discrete Capacitors for Emerging Embedded Technology Written By: Radim Uher | Tomas Zednicek Abstract: Passive components can represent as much as 70% of PCB footprint in today’s electronic systems. The development of a suitable technology whereby integrated passive components are embedded into the PCB body has been one of the key trends in downsizing for more than a decade. Latest achievements have allowed the implementation of this ‘embedding technology’ into pre-production and even mass production. The next step requires the involvement of the complete supply chain, including traditional passive component manufacturers. This paper will present the state of the art in the development of ultrathin discrete capacitor technology and discuss the challenges of overcoming mechanical, electrical and thermo-mechanical issues

Thermal Management of Surface Mounted Tantalum Capacitors

Thermal Management of Surface Mounted Tantalum Capacitors

Thermal Management of Surface Mounted Tantalum Capacitors Written By: Ian Salisbury Abstract: This paper covers thermal management of surface mounted tantalum capacitors, and explores the thermal characteristics and how these are modified by the thermal interconnection substrate. The paper explores the different methods of mounting to reduce the thermal resistance to the PCB, also the affect of the design of connection pads on the PCB to reduce the thermal stress on the capacitor.

Thermal and Electrical Breakdown Versus Reliability of Ta2O5 under Both – Bipolar Biasing Conditions

Thermal and Electrical Breakdown Versus Reliability of Ta2O5 under Both – Bipolar Biasing Conditions

Thermal and Electrical Breakdown Versus Reliability of Ta2O5 under Both – Bipolar Biasing Conditions Written By: P. Vašina | T. Zedníček | Z. Sita | J. Sikula | J. Pavelka Abstract: Our investigation of breakdown is mainly oriented to find a basic parameters describing the phenomena as well as its impact on reliability and quality of the final product that is “GOOD” tantalum capacitor. Basically, breakdown can be produced by a number of successive processes: thermal breakdown because of increasing conductance by Joule heating, avalanche and field emission break, an electromechanical collapse due to the attractive forces between electrodes electrochemical deterioration, dendrite formation and so on. Breakdown causes destruction in the insulator and across the electrodes mainly by melting and