Thin-Film Passives in RF/Microwave Circuits
Written By: Ron Demcko Abstract:
Until recently, most microwave capacitors were based on fired multilayer ceramic technology. In this process, layers of highly conductive electrode metal alloys are interleaved with low-loss ceramic dielectrics in a multilayer fashion until the target capacitance is obtained. The resulting stack is then sintered into a monolithic structure in a high-temperature firing process. This process continues to satisfactorily serve highpower capacitor needs in addition to those in larger value RF capacitors… DOWNLOAD TECHNICAL PAPER
Until recently, most microwave capacitors were based on fired multilayer ceramic technology. In this process, layers of highly conductive electrode metal alloys are interleaved with low-loss ceramic dielectrics in a multilayer fashion until the target capacitance is obtained. The resulting stack is then sintered into a monolithic structure in a high-temperature firing process. This process continues to satisfactorily serve highpower capacitor needs in addition to those in larger value RF capacitors…
