Global platform for the embedded community The embedded world Exhibition & Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to complex system design. Its expertise and sharp focus on technologies, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers, system architects, product managers and technical management.
The new A-Series offers the industry’s widest range of AEC-Q200-compliant antennas for automotive applications, including wireless battery management systems, telematics control units, and vehicle access key fobs. FOUNTAIN INN, S.C. (January 9, 2023) – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new A-Series low-profile, surface-mount automotive antennas today at CES 2024 in Las Vegas. CES is the most powerful tech event in the world — the proving ground for breakthrough technologies and global innovators — and KYOCERA AVX is exhibiting and offering new A-Series sample kits at Booth #10545 in the North Hall of the Las Vegas Convention Center today, Tuesday, January 9, through this
Laser Direct Structuring (LDS): Working Principles and Benefits for RF Applications Written By: Youssef Laamimat Abstract: The growing prevalence of electronic devices presents a challenge to numerous industries and markets. Addressing the industry’s need for lighter and more compact components, LDS stands out as an excellent choice. In addition, it accelerates prototype production and streamlines time-to-market. Laser Direct Structuring (LDS) technology is a revolutionary approach offering a streamlined and efficient process for creating complex 3D circuits on a myriad of substrates. LDS technology is ideal when more curves are needed or less 3D volume is available. In RF applications such as antennas, this allows the manufacture of highly intricate designs, reduces assembly costs of having the antenna outside the device,