FOUNTAIN INN, S.C. (October 24, 2016) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, is exhibiting at the 26th biennial Electronica — the premier global trade fair for electronic components, systems, and applications — which will take place November 8 – 11, 2016 in Munich.
Exhibiting in Hall B6 at Booth 314, prominent AVX personnel will be onsite to promote the company’s vast portfolio of advanced passive and interconnect components for automotive, medical, defense, aerospace, industrial, and consumer applications.
Passive products that will be showcased at the event include: the latest high capacitance releases for automotive MLCCs, DC link film capacitors for electric vehicles, and two new supercapacitor series.
AVX’s Automotive MLCC Series is qualified to AEC-Q200; available in both X7R and NP0 dielectrics with a wide range of case sizes, capacitance values, and working voltages; and is ideal for use in automotive applications including: advanced driver assistance systems (ADAS), core processor power decoupling, sensors, cameras, and radar, amongst others. Its high CV parts eliminate common power quality issues in these and other high-reliability applications, and the small case sizes enable shrunken modules and optimal electrical placement within circuits.
AVX’s FHC Series DC link film capacitors were especially designed for use in conjunction with Infineon’s HybridPACK™1 and HybridPACK™2 modules in electric vehicle applications. Qualified to AEC-Q200, the series employs a thin metallized polypropylene dielectric that exhibits a controlled self-healing process, and an internal elementary bobbin that’s used as a brick to reduce thermal expansion constraints and enable flexibility in terms of internal design, current capabilities, and repartitioning.
AVX’s SCC Series supercapacitors and SCM Series supercapacitor modules combine very high capacitance values with very low ESR to achieve excellent pulse power handling characteristics. Capable of being used alone or in conjunction with primary or secondary batteries, both series deliver extended back-up times, longer battery life, and instantaneous power pulses as-needed in applications including: uninterrupted power supplies, camera flash systems, remote metering equipment, scanners, toys, and games, in addition to a variety of hold-up, energy harvesting, and GSM/GSR pulse power applications.
Interconnect products that will be showcased at the event include the 15 board-to-board, wire-to-board, battery, and pogo pin connectors featured in AVX’s innovative new interconnect sample kit, which highlights solutions that are ideal for use in consumer, medical, industrial, and IoT applications that demand small size and high-reliability performance. Available as both a physical sample and as an interactive online simulation, the kit also features several of the STRIPT™ UL-approved, insulator-less single contacts AVX pioneered to deliver complete connector performance with lower costs and profiles.
For more information about the advanced passive and interconnect components that AVX will showcase at Electronica 2016, please visit the embedded links above – or – if you’re planning to attend Electronica, visit AVX in Hall B6 at Booth 314, November 8 – 11. To schedule an appointment with an AVX representative at Electronica 2016, please contact Rosemarie Krause, technical editor, Elektronikpraxis, at email@example.com or +49 (89) 9066-37. For all other inquiries, please contact us.
STRIPT™ is trademarked by AVX Corporation. HybridPACK™1 and HybridPACK™2 are trademarked by Infineon Technologies AG.